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Title:
TEMPORARY PROTECTIVE MATERIAL
Document Type and Number:
WIPO Patent Application WO/2023/042840
Kind Code:
A1
Abstract:
The present invention provides a temporary protective material that has excellent hot water removing properties and has water resistance and adhesion that make it possible to protect a component mounting surface in a step for mounting a semiconductor substrate. The present invention is a temporary protective material containing a polyvinyl alcohol-based resin and boric acid. The polyvinyl alcohol-based resin contains a modified polyvinyl alcohol-based resin having a constituent unit having a polar group.

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Inventors:
YONEDA YOSHIKAZU (JP)
YAMADA TASUKU (JP)
Application Number:
PCT/JP2022/034338
Publication Date:
March 23, 2023
Filing Date:
September 14, 2022
Export Citation:
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Assignee:
SEKISUI CHEMICAL CO LTD (JP)
International Classes:
B32B27/30; B32B27/32; C09J7/38; C09J11/04; C09J129/04; H01L21/02; H01L21/301; H01L21/304; H01L21/50
Domestic Patent References:
WO2013089066A12013-06-20
WO2016076261A12016-05-19
Foreign References:
JP2019172839A2019-10-10
JP2007334228A2007-12-27
JP2013225498A2013-10-31
JP2008527412A2008-07-24
Attorney, Agent or Firm:
WISEPLUS IP FIRM (JP)
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