Title:
TESTING METHOD FOR SEMICONDUCTOR WAFER, SEMICONDUCTOR WAFER TRANSPORT DEVICE, AND SEMICONDUCTOR WAFER TESTING DEVICE
Document Type and Number:
WIPO Patent Application WO/2012/026036
Kind Code:
A1
Abstract:
A method for testing a semiconductor wafer (100) using a probe card (21) comprises a step (S11) for forming a sealed space (37) between a chuck (33) and the probe card (21), a step (S12) for reducing the pressure in the sealed space (37), and a step (S14) for moving the chuck (33) a prescribed amount toward the probe card (21) in a state of reduced pressure in the sealed space (37).
Inventors:
KIYOKAWA TOSHIYUKI (JP)
Application Number:
PCT/JP2010/064608
Publication Date:
March 01, 2012
Filing Date:
August 27, 2010
Export Citation:
Assignee:
ADVANTEST CORP (JP)
KIYOKAWA TOSHIYUKI (JP)
KIYOKAWA TOSHIYUKI (JP)
International Classes:
H01L21/66
Foreign References:
| JPH11238770A | 1999-08-31 | |||
| JP2008294292A | 2008-12-04 | |||
| JP2008224586A | 2008-09-25 |
Attorney, Agent or Firm:
TOKOSHIE PATENT FIRM (JP)
It can exceed and is a patent business corporation. (JP)
It can exceed and is a patent business corporation. (JP)
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