THERMAL ANALYSIS METHOD, THERMAL ANALYSIS DEVICE AND COMPUTER PROGRAM

WIPO Patent Application WO/2023/281968

A1

A thermal analysis method, thermal analysis device and computer program are provided which, while reducing processing load of thermal analysis and reducing computational cost, performs a high-precision heat transfer simulation of a structure or space while avoiding reductions in calculation accuracy that accompany discretization during region segmentation. The spatial distribution of the heat flux vector J and the temperature gradient vector ∇T is acquired by performing thermal analysis of a structure or space using a computational mesh generated by an initial segmentation means 2a, by taking the absolute value of the volume integral, over the subdivided areas, of the inner product J⋅∇T of the heat flux vector J and the temperature gradient vector ∇T, heat countermeasure sensitivity indices Rd1, Rd2, Rd3, Rd4 are calculated for each subdivided area. Further, among the calculated heat countermeasure sensitivity indices, for a prescribed number of subdivided areas that have a high index value, for example, for one subdivided area 4a, further subdivision of the computational mesh and re-segmentation of the subdivided areas are performed, and that computational mesh is used to perform thermal analysis again.

YAMAYOSE YUU (JP)
SHIBAHARA TERUHISA (JP)
FUKUNISHI MASATAKA (JP)

PCT/JP2022/023044

January 12, 2023

June 08, 2022

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MURATA MANUFACTURING CO (JP)

G06F30/23; G06F119/08

JP2002189761A	2002-07-05
JP2013012004A	2013-01-17
JP2003216660A	2003-07-31
JPH0429021A	1992-01-31

MINEGISHI Takeshi (JP)

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