Title:
THERMAL BONDING SHEET, THERMAL BONDING SHEET WITH DICING TAPE, BONDED BODY PRODUCTION METHOD, AND POWER SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2017/163503
Kind Code:
A1
Abstract:
A thermal bonding sheet having a pre-sintering layer containing copper particles and polycarbonate.
Inventors:
SUGO YUKI (JP)
KAMAKURA NAO (JP)
HONDA SATOSHI (JP)
KAMAKURA NAO (JP)
HONDA SATOSHI (JP)
Application Number:
PCT/JP2016/087075
Publication Date:
September 28, 2017
Filing Date:
December 13, 2016
Export Citation:
Assignee:
NITTO DENKO CORP (JP)
International Classes:
B22F7/08; B22F1/00; B23K20/00; H01L21/52
Domestic Patent References:
| WO2015034579A1 | 2015-03-12 |
Foreign References:
| JP2002030306A | 2002-01-31 | |||
| JP2008031491A | 2008-02-14 | |||
| JP2005166938A | 2005-06-23 | |||
| JP2014111800A | 2014-06-19 | |||
| JPS60196956A | 1985-10-05 | |||
| JP2013007028A | 2013-01-10 |
Other References:
See also references of EP 3434398A4
Attorney, Agent or Firm:
UNIUS PATENT ATTORNEYS OFFICE (JP)
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