Title:
THERMAL FLOW METER, FLOW RATE CONTROL DEVICE, THERMAL FLOW RATE MEASUREMENT METHOD, AND PROGRAM FOR THERMAL FLOW METER
Document Type and Number:
WIPO Patent Application WO/2022/004001
Kind Code:
A1
Abstract:
In order to provide a thermal flow meter in which error caused by thermal siphoning can be corrected more accurately than by the prior art, the present invention comprises: a sensor flow path 4 in which a fluid to be measured flows; an upstream-side electrical resistance element Ru provided in the sensor flow path 4; a downstream-side electrical resistance element Rd provided further downstream than the upstream-side electrical resistance element Ru in the sensor flow path 4; a sensor output generator 5 for generating a sensor output that corresponds to the flow rate of the fluid to be measured, on the basis of an upstream-side voltage Vu outputted in accordance with a change in the upstream-side electrical resistance element Ru and a downstream-side voltage Rd outputted in accordance with a change in the downstream-side electrical resistance element Rd; a slope effect estimator 6 for estimating a slope effect that occurs in the sensor output in accordance with the orientation of the sensor flow path 4, on the basis of at least the Prandtl number of the fluid to be measured; and a flow rate calculator 7 for correcting the slope effect from the sensor output and calculating the flow rate of the fluid to be measured.
Inventors:
EMURA HIDETOSHI (JP)
OKANO HIROYUKI (JP)
OKANO HIROYUKI (JP)
Application Number:
PCT/JP2020/046330
Publication Date:
January 06, 2022
Filing Date:
December 11, 2020
Export Citation:
Assignee:
HORIBA STEC CO LTD (JP)
International Classes:
G01F1/696
Domestic Patent References:
| WO2007138941A1 | 2007-12-06 | |||
| WO2007023614A1 | 2007-03-01 |
Attorney, Agent or Firm:
NISHIMURA, Ryuhei (JP)
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