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Patent Searching and Data


Title:
THERMAL FLOW RATE SENSOR
Document Type and Number:
WIPO Patent Application WO/2021/260987
Kind Code:
A1
Abstract:
This invention addresses the problem of providing a thermal flow rate sensor that makes it possible to enhance resistance to contamination and damage while arranging temperature detection elements symmetrically in relation to a heat-generating resistor. This thermal flow rate sensor 300 comprises a diaphragm 310, a heat-generating resistor 303, and a pair of temperature detection elements 304. The diaphragm 310 is disposed along the flow direction Df of a gas under measurement 2 to have the flow rate thereof measured. The heat-generating resistor 303 is disposed in an intermediate part of the diaphragm 310 in the flow direction Df. The pair of temperature detection elements 304 are disposed at both ends of the diaphragm 310 in the flow direction Df. The diaphragm 310 comprises an expanded part 312 that is expanded so as to protrude, in an intersecting direction Di that intersects with the flow direction Df, from at least one lateral edge 311 from among the two lateral edges 311, 311 along the flow direction Df. At least one part of the expanded part 312 faces a temperature detection element 304 in the intersecting direction Di.

Inventors:
ZHANG LINLIN (JP)
ONOSE YASUO (JP)
NAKANO HIROSHI (JP)
OHTA KAZUHIRO (JP)
SAITO NAOKI (JP)
Application Number:
PCT/JP2021/003177
Publication Date:
December 30, 2021
Filing Date:
January 29, 2021
Export Citation:
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Assignee:
HITACHI ASTEMO LTD (JP)
International Classes:
G01F1/684; G01F1/692
Foreign References:
JP2000304584A2000-11-02
JPH1183580A1999-03-26
JP2006052944A2006-02-23
Attorney, Agent or Firm:
TODA Yuji (JP)
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