Title:
THERMAL INSULATION SHEET
Document Type and Number:
WIPO Patent Application WO/2021/235189
Kind Code:
A1
Abstract:
Provided is a thermal insulation sheet with increased followability to deformation. The thermal insulation sheet 10 comprises: an intermediate layer 11 containing inorganic fibers; and paper superficial layers 12 that are stacked on both surfaces of the intermediate layer 11 so as to have said intermediate layer 11 sandwiched therebetween. When the thermal insulation sheet is subjected to five rounds of repeated compression test in which FS load is measured by pressing said sheet to a depth of 0-1.5 mm under a temperature range from -40°C to 60°C, the test shows an FS load of 1000-6000 N at a depth of 1.5 mm. With this configuration, this thermal insulation sheet is able to achieve the property that undergoes little stress variation during a compression-restoration test where the sheet is subjected to iterations of stress variation over a wide temperature range.
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Inventors:
NAGANO TERUAKI (JP)
CHIBA HIROFUMI (JP)
CHIBA HIROFUMI (JP)
Application Number:
PCT/JP2021/016673
Publication Date:
November 25, 2021
Filing Date:
April 26, 2021
Export Citation:
Assignee:
AWA PAPER & TECH COMPANY INC (JP)
International Classes:
B32B9/00; D21H13/40; D21H27/30; F16L59/02; H01M10/658; H01M50/20
Domestic Patent References:
| WO2019088195A1 | 2019-05-09 |
Foreign References:
| JP2020063760A | 2020-04-23 | |||
| JPH04132933U | 1992-12-10 | |||
| JP2011174519A | 2011-09-08 | |||
| JPH11200286A | 1999-07-27 |
Attorney, Agent or Firm:
FUJIWARA Hisae et al. (JP)
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