THERMALLY CATIONICALLY POLYMERIZABLE COMPOSITION, ANISOTROPIC CONDUCTIVE ADHESIVE FILM, CONNECTED STRUCTURE AND MANUFACTURING PROCESS THEREFOR

WIPO Patent Application WO/2013/027541

A1

In connecting an electronic component to a glass substrate or a circuit board using a non-conductive adhesive film or an anisotropic conductive adhesive film, both films using a thermally cationically polymerizable composition that contains a thermal cationic polymerization initiator, the present invention minimizes the lifting in the adhesive interface and inhibits the bond strength from lowering remarkably. Further, in anisotropic conductive connection using an anisotropic conductive adhesive film, the present invention prevents lowering in the efficiency of conductive-particle capture between facing connecting terminals. This thermally cationically polymerizable composition contains an organoboron compound selected from among specific boric acid esters and bis(alkanediolato)diborons. This anisotropic conductive adhesive film can be obtained by dispersing conductive particles in the thermally cationically polymerizable composition and then forming the resulting composition into a film.

ITO MASAHIRO (JP)

PCT/JP2012/069288

February 28, 2013

July 30, 2012

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DEXERIALS CORP (JP)
ITO MASAHIRO (JP)

C08L63/00; C08G59/68; C09J7/10; C09J163/00; H05K3/32

WO2010035459A1

2010-04-01

JP2004277458A	2004-10-07
JPH11100563A	1999-04-13

TAJIME & TAJIME (JP)
Patent business corporation Tajime international patent firm (JP)

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