Title:
FLEXIBLE PRINTED CIRCUIT BOARD AND METHOD FOR PRODUCING FLEXIBLE PRINTED CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2013/027542
Kind Code:
A1
Abstract:
This flexible printed circuit board (10), which comprises a substrate layer (11), a wiring circuit (12a), and an insulating layer (13) comprising a photosensitive resin, is provided with an insulating layer covered region (Q1), which is covered by the insulating layer (13), and an insulating layer non-covered region (Q2), which is not covered by the insulating layer (13). When viewed from the direction perpendicular to the surface (H) of the flexible printed circuit board (10), the intersection angles (A1-A4) of the intersections of the boundary line (K1) between the insulating layer covered region (Q1) and the insulating layer non-covered region (Q2) and the line (T2) representing the side surface (12a-1) of the wiring circuit (12a) covered by the insulating layer covered region (Q1) are formed into acute angles.
Inventors:
UEDA HIROSHI (JP)
NOGUCHI KO (JP)
UEHARA SUMITO (JP)
NOGUCHI KO (JP)
UEHARA SUMITO (JP)
Application Number:
PCT/JP2012/069307
Publication Date:
February 28, 2013
Filing Date:
July 30, 2012
Export Citation:
Assignee:
SUMITOMO ELEC PRINTED CIRCUITS (JP)
UEDA HIROSHI (JP)
NOGUCHI KO (JP)
UEHARA SUMITO (JP)
UEDA HIROSHI (JP)
NOGUCHI KO (JP)
UEHARA SUMITO (JP)
International Classes:
H05K3/28
Domestic Patent References:
| WO2008059571A1 | 2008-05-22 |
Foreign References:
| JP2006073761A | 2006-03-16 | |||
| JPH04121777U | 1992-10-30 | |||
| JPH03230595A | 1991-10-14 |
Attorney, Agent or Firm:
NISHIMA, Hideaki et al. (JP)
Hideaki Futajima (JP)
Hideaki Futajima (JP)
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Claims: