THERMALLY CONDUCTIVE ADDITION CURING SILICONE COMPOSITION AND METHOD FOR PRODUCING SAME

Title:

THERMALLY CONDUCTIVE ADDITION CURING SILICONE COMPOSITION AND METHOD FOR PRODUCING SAME

Document Type and Number:

WIPO Patent Application WO/2021/095501

Kind Code:

A1

Abstract:

This thermally conductive addition curing silicone composition contains: a heated mixture of an organopolysiloxane having at least two alkenyl groups bonded to silicon atoms in one molecule, an organohydrogen polysiloxane having at least three hydrogen atoms bonded to silicon atoms in one molecule, and aluminum oxide particles having an Na+ ion level of 50 ppm or less when an aluminum oxide powder is heat extracted by pure water for 24 hours at 60°C and the resultant water layer is measured by ion chromatography, the aluminum oxide particles having been surface-treated by the organohydrogen polysiloxane; an organohydrogen polysiloxane having two or more hydrogen atoms bonded to silicon atoms in one molecule; and a platinum group metal catalyst. Said composition can be applied to the inside of a module including electrical/electronic components and a circuit board on which these compounded are mounted, and can exhibit exceptional post-curing stress relaxation properties and thermal conductivity.

Inventors:

IWATA MITSUHIRO (JP)
TABATA YUJI (JP)
TAKAHASHI TOKO (JP)
ISHIDA RIO (JP)

Application Number:

PCT/JP2020/040097

Publication Date:

May 20, 2021

Filing Date:

October 26, 2020

Export Citation:

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Assignee:

SHINETSU CHEMICAL CO (JP)

International Classes:

C08L83/04; C08K3/22; C08L83/05; C08L83/06; C08L83/07

Foreign References:

JP2011122084A	2011-06-23
JP2005344106A	2005-12-15
JP2007233084A	2007-09-13
JP2741436B2	1998-04-15
JP3676544B2	2005-07-27
JPS5821160B2	1983-04-27

Other References: