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Title:
THERMALLY CONDUCTIVE COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2022/190674
Kind Code:
A1
Abstract:
[Problem] To provide a composition which has improved flexibility in a temperature range where cooling is necessary and which is excellent in terms of roll processability and mold releasability. [Solution] The composition comprises 100 parts by mass of an ethylene/propylene/diene rubber and above 1500 parts by mass of an inorganic filler and contains a metal salt of a fatty acid.

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Inventors:
YAMASHITA HIKARU (JP)
SZE MARK ANTHONY SY (JP)
Application Number:
PCT/JP2022/002455
Publication Date:
September 15, 2022
Filing Date:
January 24, 2022
Export Citation:
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Assignee:
OHTSUKA POLYTECH CO LTD (JP)
International Classes:
C08K3/013; C08L23/16; C08K3/22; C08K3/24; C08K7/18; C08L23/06
Domestic Patent References:
WO2014083890A12014-06-05
Foreign References:
JP2006052273A2006-02-23
JP2013072032A2013-04-22
JP2018035350A2018-03-08
JP2006291078A2006-10-26
JP2002047382A2002-02-12
Attorney, Agent or Firm:
OSHIMA & PARTNERS (JP)
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