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Patent Searching and Data


Title:
THERMALLY CONDUCTIVE MOLDED BODY AND METHOD FOR THE PRODUCTION THEREOF
Document Type and Number:
WIPO Patent Application WO/2013/092700
Kind Code:
A3
Abstract:
The invention relates to a method for producing a thermally conductive molded body having thermal conduction properties, comprising the following steps: a) producing a mixture of at least two components present in a pourable state in specified amount ratios, comprising a material having high thermal conductivity and an additional material made of at least two constituents having different melting points; b) introducing the mixture into a mold; c) pressing the mixture into the desired shape; d) heating the mixture to a temperature that is greater than the lower of the different melting temperatures; and e) cooling and unmolding the cross-linked molded body.

Inventors:
KRIESI RUEDI (CH)
Application Number:
PCT/EP2012/076134
Publication Date:
August 15, 2013
Filing Date:
December 19, 2012
Export Citation:
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Assignee:
ZEHNDER VERKAUF VERWALTUNG (CH)
International Classes:
D04H1/541; D04H3/147; F28F21/02
Foreign References:
JPH05230751A1993-09-07
US4946738A1990-08-07
Attorney, Agent or Firm:
STENGER WATZKE RING (Am Seestern 8, Düsseldorf, DE)
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