Title:
THERMALLY-CONDUCTIVE SHEET, METHOD FOR INSTALLING SAME, AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2023/190585
Kind Code:
A1
Abstract:
A thermally-conductive sheet comprises a binder component, which is a mixture of a silicone matrix (A) and an alkyl silicone compound (B), and a thermally-conductive filler (C), which is dispersed in the binder component, wherein the content of the alkyl silicone compound (B) is 2.0 to 20 parts by mass relative to 100 parts by mass of the total of the silicone matrix (A) and the alkyl silicone compound (B), and the expansion rate X is at least -2.0% but less than 0%, as measured by a thermomechanical analyzer (TMA) under conditions of a compressive load of 0.01N, a measurement temperature of 30-80°C and a rate of temperature increase of 2°C/minute.
Inventors:
KUROO KENTA (JP)
IWAZAKI HIROMICHI (JP)
KUDOH HIROKI (JP)
IWAZAKI HIROMICHI (JP)
KUDOH HIROKI (JP)
Application Number:
PCT/JP2023/012649
Publication Date:
October 05, 2023
Filing Date:
March 28, 2023
Export Citation:
Assignee:
SEKISUI POLYMATECH CO LTD (JP)
International Classes:
H01L23/36; B32B27/00; C08J5/18
Domestic Patent References:
| WO2022137762A1 | 2022-06-30 | |||
| WO2022163192A1 | 2022-08-04 |
Foreign References:
| JP2004331835A | 2004-11-25 | |||
| JP2002234952A | 2002-08-23 | |||
| JP2000327917A | 2000-11-28 |
Attorney, Agent or Firm:
TAGUCHI, Masahiro et al. (JP)
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