Title:
THERMALLY-CONDUCTIVE SHEET
Document Type and Number:
WIPO Patent Application WO/2023/190586
Kind Code:
A1
Abstract:
A thermally-conductive sheet including a binder and a thermally-conductive filler dispersed in the binder, and being sandwiched and used between a heat-generating body and a heat-radiating body, wherein the reflectance of the surfaces of the thermally-conductive sheet that are in contact with the heat-generating body and the heat-radiating body is 0.30% or more.
Inventors:
KUROO KENTA (JP)
IWAZAKI HIROMICHI (JP)
KUDOH HIROKI (JP)
IWAZAKI HIROMICHI (JP)
KUDOH HIROKI (JP)
Application Number:
PCT/JP2023/012650
Publication Date:
October 05, 2023
Filing Date:
March 28, 2023
Export Citation:
Assignee:
SEKISUI POLYMATECH CO LTD (JP)
International Classes:
H01L23/373; H01L23/36; H05K7/20
Foreign References:
| JP2012039067A | 2012-02-23 | |||
| JP2004331835A | 2004-11-25 |
Attorney, Agent or Firm:
TAGUCHI, Masahiro et al. (JP)
Download PDF: