Title:
THERMALLY CONDUCTIVE SHEET AND METHOD FOR MANUFACTURING THERMALLY CONDUCTIVE SHEET
Document Type and Number:
WIPO Patent Application WO/2022/085284
Kind Code:
A1
Abstract:
Provided is a thermally conductive sheet in which it is possible to lower any reduction thermal conductivity when a load increases. This thermally conductive sheet 1 contains a binder resin, a scale-form first thermally conductive filler, and a non-scale-form second thermally conductive filler, the first thermally conductive filler and the second thermally conductive filler being distributed in the binder resin, the long axis of the first thermally conductive filler being oriented in the thickness direction of the thermally conductive sheet, and the short axis of the first thermally conductive filler being oriented in the in-plane direction of the thermally conductive sheet.
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Inventors:
SATO YUMA (JP)
ARAMAKI KEISUKE (JP)
KUBO YUSUKE (JP)
ARAMAKI KEISUKE (JP)
KUBO YUSUKE (JP)
Application Number:
PCT/JP2021/030065
Publication Date:
April 28, 2022
Filing Date:
August 17, 2021
Export Citation:
Assignee:
DEXERIALS CORP (JP)
International Classes:
H01L23/36; C08K3/22; C08K3/38; C08K13/04; C08L83/00; C08L101/00; H05K7/20
Domestic Patent References:
| WO2017179318A1 | 2017-10-19 | |||
| WO2020105601A1 | 2020-05-28 |
Foreign References:
| JP2012023335A | 2012-02-02 | |||
| JP2013131564A | 2013-07-04 | |||
| JP2009094110A | 2009-04-30 | |||
| JP2002237554A | 2002-08-23 | |||
| JP2015035580A | 2015-02-19 | |||
| JP2011012193A | 2011-01-20 |
Attorney, Agent or Firm:
NOGUCHI, Nobuhiro (JP)
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