Title:
THERMALLY CONDUCTIVE SHEET AND METHOD FOR PRODUCING THERMALLY CONDUCTIVE SHEET
Document Type and Number:
WIPO Patent Application WO/2023/190587
Kind Code:
A1
Abstract:
The present invention provides a thermally conductive sheet which comprises a matrix that is formed of an organic polymer, and a fibrous filler, wherein: the thickness of the thermally conductive sheet is less than 200 µm; the fibrous filler is oriented in the thickness direction of the thermally conductive sheet; and the ratio (D50/T) of the average fiber length D50 of the fibrous filler to the thickness (T) of the thermally conductive sheet is less than 0.58.
Inventors:
IWAZAKI HIROMICHI (JP)
KUROO KENTA (JP)
KUDOH HIROKI (JP)
KUROO KENTA (JP)
KUDOH HIROKI (JP)
Application Number:
PCT/JP2023/012651
Publication Date:
October 05, 2023
Filing Date:
March 28, 2023
Export Citation:
Assignee:
SEKISUI POLYMATECH CO LTD (JP)
International Classes:
H01L23/373; H05K7/20
Domestic Patent References:
| WO2017179318A1 | 2017-10-19 | |||
| WO2022070680A1 | 2022-04-07 |
Foreign References:
| JP2018046073A | 2018-03-22 |
Attorney, Agent or Firm:
TAGUCHI, Masahiro et al. (JP)
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