THERMALLY-CONDUCTIVE SILICONE COMPOSITION

WIPO Patent Application WO/2018/230189

A1

This thermally-conductive silicone composition exhibits, after being cured, a small increase in hardness when being aged at a high temperature, and also any decrease in curing speed is constrained, wherein the composition contains (A) an organopolysiloxane having at least two alkenyl groups per molecule, and having a kinematic viscosity of 10-100,000 mm2/s at 25ºC, (B) a hydrolyzable methyl polysiloxane having three functional groups at one terminal thereof, (C) a thermally-conductive filler having a thermal conductivity of 10 W/m·ºC or higher, (D) an organohydrogenpolysiloxane having hydrogen atoms bonded directly to at least two silicon atoms per molecule, (E) a catalyst selected from the group consisting of platinum and platinum compounds, (F) a specific amount of a triazole compound, and (G) a specific amount of an isocyanate compound.

JP6355646	Curable silicone compositions, conductive silicone adhesives, how they are manufactured and used, and electrical appliances that contain them.
JPH0550036	PRODUCTION OF SILICONE RUBBER THIN-FILM LAYER
JPH086039	INDUSTRIAL APPLICABILITY: Organopolysiloxane composition and gel-cured product thereof.

TSUJI KENICHI (JP)
KATO NOBU (JP)

PCT/JP2018/017750

December 20, 2018

May 08, 2018

Click for automatic bibliography generation  

SHINETSU CHEMICAL CO (JP)

C08L83/07; C08K5/29; C08K5/3472; C08K5/5465; C08L83/05; C08L83/06

WO2018079309A1

2018-05-03

JP2017031364A	2017-02-09
JP2004168920A	2004-06-17

PATENT PROFESSIONAL CORPORATION EI-MEI PATENT OFFICE (JP)

View/Download PDF      PDF Help

Previous Patent: ROTATION DETECTION DEVICE

Next Patent: ALIGNMENT METHOD, ALIGNMENT DEVICE, AND TESTING DEVICE