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Patent Searching and Data


Title:
THERMALLY SUPERCONDUCTING HEAT DISSIPATION DEVICE AND MANUFACTURING METHOD THEREOF
Document Type and Number:
WIPO Patent Application WO/2017/005138
Kind Code:
A1
Abstract:
Provided are a thermally superconducting heat dissipation device and manufacturing method thereof. The thermally superconducting heat dissipation device comprises multiple spacers, and multiple thermally superconducting heat dissipation fins (1). The multiple spacers and the multiple thermally superconducting heat dissipation fins (1) are arranged in an alternating manner, and respective one sides of the spacers are aligned with respective one sides of the thermally superconducting heat dissipation fins (1) to collaboratively form a mounting surface for installation of a power device. The thermally superconducting heat dissipation fins (1) are connected and fixed to the spacers. The conventional heat dissipation blades are replaced with the thermally superconducting heat dissipation fins (1) so that the thermally superconducting heat dissipation device has a higher heat dissipation rate. The heat dissipation efficiency of the thermally superconducting heat dissipation fins is high and not affected by high temperatures, thereby increasing heat dissipation capability of the heat dissipation device. Moreover, the thermally superconducting heat dissipation device can be manufactured conveniently and flexibly at a low cost, and features increased heat dissipation capability, a light weight and a compact size.

Inventors:
TONG AIXING (CN)
SI ZHENGMING (CN)
Application Number:
PCT/CN2016/088096
Publication Date:
January 12, 2017
Filing Date:
July 01, 2016
Export Citation:
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Assignee:
ZHEJIANG JIAXI OPTOELECTRONIC EQUIPMENT MFG CO LTD (CN)
International Classes:
H01L23/373; H01L23/367
Foreign References:
CN105140194A2015-12-09
US5381859A1995-01-17
CN201327002Y2009-10-14
Attorney, Agent or Firm:
J.Z.M.C. PATENT AND TRADEMARK LAW OFFICE (CN)
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