Title:
THERMOPLASTIC RESIN COMPOSITION AND THERMOPLASTIC RESIN MOLDED ARTICLE
Document Type and Number:
WIPO Patent Application WO/2005/056685
Kind Code:
A1
Abstract:
Disclosed is a recyclable thermoplastic resin composition which is excellent in electrical conductivity, strength, flexibility, durability and surface smoothness. Also disclosed is a thermoplastic resin molded article which is obtained by molding such a thermoplastic resin composition. More specifically, the thermoplastic resin composition contains a thermoplastic resin, Ketjenblack or carbon nanotubes and vapor-grown carbon fibers, and the thermoplastic resin molded article is obtained by molding this thermoplastic resin composition.
Inventors:
OBA TAKESHI (JP)
Application Number:
PCT/JP2004/018653
Publication Date:
June 23, 2005
Filing Date:
December 14, 2004
Export Citation:
Assignee:
BRIDGESTONE CORP (JP)
OBA TAKESHI (JP)
OBA TAKESHI (JP)
International Classes:
C08L101/00; C08J5/00; C08K3/04; C08K7/06; H01B1/24; H01M8/02; (IPC1-7): C08L101/00; C08K3/04; C08K7/06; H01M8/02
Foreign References:
| JPH06122785A | 1994-05-06 | |||
| JPH0831231A | 1996-02-02 | |||
| JP2003115302A | 2003-04-18 | |||
| JP2004139966A | 2004-05-13 |
Attorney, Agent or Firm:
Sugimura, Kosaku (2-4 Kasumigaseki 3-chom, Chiyoda-ku Tokyo 13, JP)
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