THERMOPLASTIC RESIN COMPOSITION, POLYMER COMPOSITION, AND MOLDED OBJECT OBTAINED FROM THE COMPOSITION

Title:

THERMOPLASTIC RESIN COMPOSITION, POLYMER COMPOSITION, AND MOLDED OBJECT OBTAINED FROM THE COMPOSITION

Document Type and Number:

WIPO Patent Application WO/2003/106554

Kind Code:

A1

Abstract:

A thermoplastic resin composition (Y) characterized by comprising (A) 20 to 64.9 wt.% one or more ethylene copolymers comprising an ethylene/&agr -olefin copolymer, (B) 35 to 70 wt.% metal hydroxide, and (C) 0.1 to 30 wt.% grafted ethylene polymer. The resin composition has excellent flame retardancy and has satisfactory pliability/flexibility and excellent tensile properties. It is suitable for use as an insulating material or sheath for electric wires. Also provided are: a polymer composition (Z) having high flame retardancy, characterized by comprising (AA) 100 parts by weight of a polymer such as a thermoplastic polymer or thermosetting polymer, (BB) 50 to 250 parts by weight of a metal hydroxide, (E) 0.1 to 40 parts by weight of a triazine compound, and (F) 0.1 to 40 parts by weight of a polyhydric alcohol; and a molded object obtained from the polymer composition. These are suitable for use as an insulating material or sheath for electric wires.

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Inventors:

UEHARA HIROSHI (JP)
KIMURA TOMOHIKO (JP)
MORIYA SATORU (JP)
YAMAGUCHI MASAYOSHI (JP)
KAWACHI HIDESHI (JP)

Application Number:

PCT/JP2003/006987

Publication Date:

December 24, 2003

Filing Date:

June 03, 2003

Export Citation:

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Assignee:

MITSUI CHEMICALS INC (JP)
UEHARA HIROSHI (JP)
KIMURA TOMOHIKO (JP)
MORIYA SATORU (JP)
YAMAGUCHI MASAYOSHI (JP)
KAWACHI HIDESHI (JP)

International Classes:

C08K5/00; C08K5/053; C08K5/3492; C08L23/08; H01B3/44; C08K3/20; C08L23/04; C08L51/06; (IPC1-7): C08L23/08; C08K3/22; C08K5/3495; C08K5/053; H01B3/44

Foreign References:

JP2002018992A	2002-01-22
JP2000272036A	2000-10-03
JPH10237237A	1998-09-08
JP2000251538A	2000-09-14
JPH09221567A	1997-08-26
JP2000239459A	2000-09-05
JPH0959441A	1997-03-04

Other References: