Title:
THERMOSETTING COMPOSITION, CURED PRODUCT, DEVICE, AND DEVICE MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2022/024838
Kind Code:
A1
Abstract:
The present disclosure provides a thermosetting composition that contains an epoxy resin and a thiol compound, enables temporary adhesion, and exhibits favorable storage stability. The thermosetting composition according to the present disclosure contains: an epoxy resin (A); a thiol compound (B) having at least two intramolecular thiol groups; a radically polymerizable compound (C); a photo-radical polymerization initiator (D); and a radical scavenger (E).
Inventors:
FUJITA HARUKA
SARUWATARI TAKASHI
SHINOZAKI HIROKI
SARUWATARI TAKASHI
SHINOZAKI HIROKI
Application Number:
PCT/JP2021/026963
Publication Date:
February 03, 2022
Filing Date:
July 19, 2021
Export Citation:
Assignee:
PANASONIC IP MAN CO LTD (JP)
International Classes:
C08G59/66; C08G75/045; C08K3/00; C08K5/55; C08L81/00; C09J4/00; C09J11/06; C09J163/00
Domestic Patent References:
| WO2005052021A1 | 2005-06-09 |
Foreign References:
| JP2018172565A | 2018-11-08 | |||
| JP2020045435A | 2020-03-26 | |||
| JP2000154226A | 2000-06-06 |
Attorney, Agent or Firm:
HOKUTO PATENT ATTORNEYS OFFICE (JP)
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