Title:
THERMOSETTING COMPOSITION, MOLDING MATERIAL, MOLDED STRUCTURE, AND METHOD OF DECOMPOSING THEM
Document Type and Number:
WIPO Patent Application WO/1995/029205
Kind Code:
A1
Abstract:
A thermosetting composition which comprises an unsaturated polyester, and addition-polymerizable monomer, a shrinkage reducing agent other than aliphatic polyesters, and an aliphatic polyester, and which can be decomposed, after being set, by a decomposing solution containing a base and at least one solvent selected from the group consisting of water, methanol, ethanol and ethylene glycol at a temperature lower than the boiling point of the solution.
Inventors:
TERADA TAKAHIKO (JP)
ONISHI HIROSHI (JP)
ONISHI HIROSHI (JP)
Application Number:
PCT/JP1995/000816
Publication Date:
November 02, 1995
Filing Date:
April 26, 1995
Export Citation:
Assignee:
MATSUSHITA ELECTRIC IND CO LTD (JP)
TERADA TAKAHIKO (JP)
ONISHI HIROSHI (JP)
TERADA TAKAHIKO (JP)
ONISHI HIROSHI (JP)
International Classes:
C08L63/00; C08L67/06; H02K5/02; H02K15/00; (IPC1-7): C08L67/02; C08L67/04; C08L67/06; C08F283/01; H02K5/08; C08L101/00
Foreign References:
| JPH03192153A | 1991-08-22 | |||
| JPH03192108A | 1991-08-22 | |||
| JPS6343947A | 1988-02-25 | |||
| JPS61123657A | 1986-06-11 | |||
| JPS52137601A | 1977-11-17 | |||
| JPS53108193A | 1978-09-20 |
Other References:
See also references of EP 0707043A4
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