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Title:
THERMOSETTING RESIN COMPOSITION AND CURED FILM
Document Type and Number:
WIPO Patent Application WO/2021/229764
Kind Code:
A1
Abstract:
The problem of the present invention is to obtain a thermosetting resin composition in which ester exchange having a good heat curing property is used for a curing reaction. This thermosetting resin composition contains a resin component (A), which includes an alkyl ester group (a) and a hydroxyl group (b), and an ester exchange catalyst (B), wherein the resin component (A) includes, in at least a portion thereof, a resin component having a structural unit derived from 2-methylene glutaric acid diester.

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Inventors:
MORIWAKI YUYA (JP)
MATSUDA TOMOYA (JP)
ASADA KOSUKE (JP)
DONKAI MASARU (JP)
NAKAGAWA HIROKI (JP)
MAEO KEIJI (JP)
YOSHIDA NARUTOSHI (JP)
TAKENAKA NAOMI (JP)
Application Number:
PCT/JP2020/019329
Publication Date:
November 18, 2021
Filing Date:
May 14, 2020
Export Citation:
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Assignee:
KYOEISHA CHEMICAL CO LTD (JP)
International Classes:
C08F222/10; C08L35/02
Domestic Patent References:
WO2019069783A12019-04-11
Foreign References:
JPH0892503A1996-04-09
JPS57145143A1982-09-08
JP2017063196A2017-03-30
JPS6354022B21988-10-26
Attorney, Agent or Firm:
TASS MEISTER PATENT FIRM (JP)
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