Title:
THERMOSETTING RESIN COMPOSITION, CURED PRODUCT AND PREPREG THEREOF, AND LAMINATED SHEET, METAL FOIL-LAMINATED SHEET, AND PRINTED WIRING BOARD HAVING SAID CURED PRODUCT OR CURED PREPREG
Document Type and Number:
WIPO Patent Application WO/2022/215831
Kind Code:
A1
Abstract:
Provided are a thermosetting resin composition capable of quickly forming a resin layer having a sufficiently low relative permittivity and dielectric tangent and high flexibility and toughness, and a cured product, prepreg, laminated sheet, metal foil-laminated sheet, and printed wiring board of the thermosetting resin composition. The thermosetting resin composition comprises (A) a polymeric polyphenylene ether compound of general formula (1), (B) an elastomer, and (C) tetrafluoroethylene-based polymer particles, wherein the content of (C) ranges from 1 to 30 parts by mass based on 100 parts by mass of the composition.
Inventors:
SHIRAKI SHINJI (JP)
Application Number:
PCT/KR2021/019927
Publication Date:
October 13, 2022
Filing Date:
December 27, 2021
Export Citation:
Assignee:
LG CHEMICAL LTD (KR)
International Classes:
C08L71/12; B32B15/08; C08J5/24; C08L27/18; C08L53/02; H05K1/03
Domestic Patent References:
| WO2019230531A1 | 2019-12-05 | |||
| WO2020184437A1 | 2020-09-17 |
Foreign References:
| JP2016089137A | 2016-05-23 | |||
| KR20180007306A | 2018-01-22 | |||
| JP2019001965A | 2019-01-10 |
Attorney, Agent or Firm:
CHOI, Hee-Kyeong et al. (KR)
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