Title:
THERMOSETTING RESIN COMPOSITION, HEAT DISSIPATION SHEET, HEAT DISSIPATION PLATE, METHOD FOR MANUFACTURING HEAT DISSIPATION SHEET, AND METHOD FOR MANUFACTURING HEAT DISSIPATION PLATE
Document Type and Number:
WIPO Patent Application WO/2023/068024
Kind Code:
A1
Abstract:
This thermosetting resin composition contains an epoxy resin, a curing agent, an acrylic copolymer having a functional group in a side chain thereof, boron nitride, and a filler. The average particle diameter (D50) of the boron nitride is 7.0-60 μm. The average particle diameter (D50) of the filler is 0.5-5.0 μm. The volume fraction of the boron nitride is 55-70 vol% with respect to 100 vol% of the thermosetting resin composition. The volume fraction of the filler is 0.3-2.0 vol% with respect to 100 vol% of the thermosetting resin composition.
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Inventors:
KANO KAZUTAKA (JP)
TOYAMA YUJI (JP)
YANO MASAE (JP)
ABE SAKI (JP)
SUDOU KEISUKE (JP)
TOYAMA YUJI (JP)
YANO MASAE (JP)
ABE SAKI (JP)
SUDOU KEISUKE (JP)
Application Number:
PCT/JP2022/036896
Publication Date:
April 27, 2023
Filing Date:
October 03, 2022
Export Citation:
Assignee:
ARISAWA SEISAKUSHO KK (JP)
International Classes:
C08L63/00; C08G59/00; C08K3/013; C08K3/38; C08K7/00; C08L33/04; H01L23/373
Domestic Patent References:
| WO2018124126A1 | 2018-07-05 | |||
| WO2021006310A1 | 2021-01-14 |
Foreign References:
| JP2013234313A | 2013-11-21 | |||
| JP2020105412A | 2020-07-09 | |||
| JP2019043804A | 2019-03-22 | |||
| JP2018188628A | 2018-11-29 | |||
| JP2012212727A | 2012-11-01 | |||
| JP2020105411A | 2020-07-09 | |||
| US20180230290A1 | 2018-08-16 |
Attorney, Agent or Firm:
KIMURA Mitsuru et al. (JP)
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