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Patent Searching and Data


Title:
THERMOSETTING RESIN COMPOSITION, PREPREG, FIBER-REINFORCED PLASTIC MOLDED BODY AND METHOD FOR PRODUCING SAME
Document Type and Number:
WIPO Patent Application WO/2018/043490
Kind Code:
A1
Abstract:
Provided is a thermosetting resin composition (C) which contains an epoxy resin, an epoxy resin curing agent and an epoxy resin curing accelerator, and wherein the epoxy resin curing agent contains an imidazole-based curing agent 1 that is not sealed in a microcapsule and a curing agent 2 that is sealed in a microcapsule, while the epoxy resin curing accelerator contains a urea derivative. Curing of this thermosetting resin composition (C) is able to be started at a relatively low temperature in a short time; and a cured product of this thermosetting resin composition (C) has high heat resistance.

Inventors:
TERANISHI Takuya (1-1 Marunouchi 1-chome, Chiyoda-k, Tokyo 51, 〒1008251, JP)
ICHINO Masahiro (1-1 Marunouchi 1-chome, Chiyoda-k, Tokyo 51, 〒1008251, JP)
IKEDA Kazuhisa (1-1 Marunouchi 1-chome, Chiyoda-k, Tokyo 51, 〒1008251, JP)
OOTA Akira (1-1 Marunouchi 1-chome, Chiyoda-k, Tokyo 51, 〒1008251, JP)
Application Number:
JP2017/030950
Publication Date:
March 08, 2018
Filing Date:
August 29, 2017
Export Citation:
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Assignee:
MITSUBISHI CHEMICAL CORPORATION (1-1 Marunouchi 1-chome, Chiyoda-ku Tokyo, 51, 〒1008251, JP)
International Classes:
C08G59/40; B29C43/20; B32B5/26; B32B27/38; C08G59/20; C08J5/24; C08K7/04; C08L63/00; B29K101/10; B29K105/08; B29L9/00
Attorney, Agent or Firm:
TAZAKI Akira et al. (1-9-2, Marunouchi Chiyoda-k, Tokyo 20, 〒1006620, JP)
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