Title:
THERMOSETTING RESIN COMPOSITION, PREPREG, FIBER-REINFORCED PLASTIC MOLDED BODY AND METHOD FOR PRODUCING SAME
Document Type and Number:
WIPO Patent Application WO/2018/043490
Kind Code:
A1
Abstract:
Provided is a thermosetting resin composition (C) which contains an epoxy resin, an epoxy resin curing agent and an epoxy resin curing accelerator, and wherein the epoxy resin curing agent contains an imidazole-based curing agent 1 that is not sealed in a microcapsule and a curing agent 2 that is sealed in a microcapsule, while the epoxy resin curing accelerator contains a urea derivative. Curing of this thermosetting resin composition (C) is able to be started at a relatively low temperature in a short time; and a cured product of this thermosetting resin composition (C) has high heat resistance.
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Inventors:
TERANISHI TAKUYA (JP)
ICHINO MASAHIRO (JP)
IKEDA KAZUHISA (JP)
OOTA AKIRA (JP)
ICHINO MASAHIRO (JP)
IKEDA KAZUHISA (JP)
OOTA AKIRA (JP)
Application Number:
PCT/JP2017/030950
Publication Date:
March 08, 2018
Filing Date:
August 29, 2017
Export Citation:
Assignee:
MITSUBISHI CHEM CORP (JP)
International Classes:
C08G59/40; B29C43/20; B32B5/26; B32B27/38; C08G59/20; C08J5/24; C08K7/04; C08L63/00; B29K101/10; B29K105/08; B29L9/00
Domestic Patent References:
| WO2013081060A1 | 2013-06-06 | |||
| WO2013081058A1 | 2013-06-06 | |||
| WO2016060166A1 | 2016-04-21 | |||
| WO2016199857A1 | 2016-12-15 | |||
| WO2004048435A1 | 2004-06-10 |
Foreign References:
| JP2016522278A | 2016-07-28 | |||
| JP2016210114A | 2016-12-15 | |||
| JP2016166878A | 2016-08-29 | |||
| JPH10128778A | 1998-05-19 | |||
| JP2002159613A | 2002-06-04 | |||
| JPH1095048A | 1998-04-14 |
Other References:
See also references of EP 3505552A4
Attorney, Agent or Firm:
TAZAKI Akira et al. (JP)
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