Title:
THERMOSETTING RESIN COMPOSITION, SEALANT FOR DISPLAY DEVICES, AND DISPLAY DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/182358
Kind Code:
A1
Abstract:
The present invention pertains to a thermosetting resin composition which contains a thermosetting agent (B) and a compound (A) having a backbone represented by general formula (1) and having two or more functional groups that are at least one of glycidyl groups and oxetanyl groups. The thermosetting resin composition has a viscosity of 20.0 Pa·s or less as measured at 25°C and 2.5 rpm using an E-type viscosity system. (In general formula (1), a represents an integer of 0-8, b represents an integer of 0-3, c represents an integer of 0-8, d represents an integer of 0-8, at least one of a, b, and c is 1 or more, n represents an integer of 1 or more, and * represents a position of a bond.)
Inventors:
KAWANO DAISUKE
Application Number:
PCT/JP2023/011241
Publication Date:
September 28, 2023
Filing Date:
March 22, 2023
Export Citation:
Assignee:
MITSUI CHEMICALS INC (JP)
International Classes:
C08G59/22; C08G59/40; C09K3/10; G02F1/1339; G02F1/161
Domestic Patent References:
| WO2021241129A1 | 2021-12-02 | |||
| WO2020235357A1 | 2020-11-26 | |||
| WO2015060439A1 | 2015-04-30 | |||
| WO2018092508A1 | 2018-05-24 |
Foreign References:
| JP2001142086A | 2001-05-25 | |||
| JP2011219682A | 2011-11-04 |
Attorney, Agent or Firm:
WASHIDA & ASSOCIATES (JP)
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