Title:
THERMOSETTING RESIN COMPOSITION, RESIN SHEET, METAL FOIL EQUIPPED WITH RESIN, LAMINATED PLATE, AND PRINTED WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2021/085191
Kind Code:
A1
Abstract:
The present invention provides a thermosetting resin composition that makes it possible to obtain a cured product having a low dielectric constant, a low dielectric dissipation factor, and high heat resistance. The thermosetting resin composition contains an ethylene-propylene-diene copolymer (A) and an organic compound (B) having a polymerizable functional group. The ethylene-propylene-diene copolymer (A) contains, by percentage, 15-50 mass% of a branched ethylene-propylene-diene copolymer (A1) with respect to the ethylene-propylene-diene copolymer (A).
Inventors:
AOKI KOUICHI
AOKI TOMOYUKI
SAITO EIICHIRO
AOKI TOMOYUKI
SAITO EIICHIRO
Application Number:
PCT/JP2020/039155
Publication Date:
May 06, 2021
Filing Date:
October 16, 2020
Export Citation:
Assignee:
PANASONIC IP MAN CO LTD (JP)
International Classes:
C08K5/103; B32B15/085; C08K3/00; C08K5/3477; C08L23/16; H05K1/03
Domestic Patent References:
| WO2019026927A1 | 2019-02-07 |
Attorney, Agent or Firm:
HOKUTO PATENT ATTORNEYS OFFICE (JP)
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