THERMOSETTING RESIN FILM, AND FIRST PROTECTIVE FILM-FORMING SHEET

Title:

THERMOSETTING RESIN FILM, AND FIRST PROTECTIVE FILM-FORMING SHEET

Document Type and Number:

WIPO Patent Application WO/2019/098329

Kind Code:

A1

Abstract:

Provided is a thermosetting resin film (12) which is applied to a surface of a semiconductor wafer which has bumps, and thermoset to form a first protective film on said surface, wherein the minimum value of the shear viscosity of the thermosetting resin film (12) at 90-130˚C is at least 500 Pa∙s when the temperature of the thermosetting resin film (12) before being thermoset is raised by 10˚C/min. Also provided is a first protective film-forming sheet (1) which is provided with a first support sheet (101), and which has, provided on one surface (101a) of the first support sheet (101), the thermosetting resin film (12).

More Like This:

WO/2006/055657	HEAT SEALABLE LIDDING MATERIAL WITH ANTI FOG
WO/2018/110830	WINDOW FILM, MANUFACTURING METHOD THEREOF, AND DISPLAY DEVICE INCLUDING SAME
WO/1997/032200	PROCESS FOR MONITORING A DISPERSE SYSTEM FOR NON-DISPERSED IMPURITIES AND DEVICE FOR CARRYING OUT SAID PROCESS

Inventors:

SHINOMIYA KEISUKE (JP)
SATO AKINORI (JP)
YAMAGISHI MASANORI (JP)

Application Number:

PCT/JP2018/042489

Publication Date:

May 23, 2019

Filing Date:

November 16, 2018

Export Citation:

Click for automatic bibliography generation Help

Assignee:

LINTEC CORP (JP)

International Classes:

C08J5/18; H01L21/60; H01L23/29; H01L23/31

Domestic Patent References:

WO2017078039A1

2017-05-11

Foreign References:

JP2017092461A	2017-05-25
JP2017188306A	2017-10-12
JP2015131969A	2015-07-23
JP2018093120A	2018-06-14

Attorney, Agent or Firm:

NISHIZAWA Kazuyoshi et al. (JP)

Download PDF:

View/Download PDF PDF Help

Previous Patent: KIT FOR IgA NEPHROPATHY DIAGNOSIS

Next Patent: LASER PEENING METHOD, METHOD FOR PRODUCING REFORMATE, LASER PEENING DEVICE, AND METAL MATERIAL