THICKNESS MEASURING METHOD, X-RAY ANALYSIS DEVICE, INFORMATION PROCESSING DEVICE, AND COMPUTER PROGRAM

WIPO Patent Application WO/2024/004990

A1

Provided are a thickness measuring method, an X-ray analysis device, an information processing device, and a computer program that can measure the thicknesses of more multilayer samples as compared to conventional means.　This thickness measuring method comprises: irradiating a sample including a first layer and a second layer which are laminated, with X-rays such that the X-rays transmit through the first layer and the second layer in the stated order; detecting fluorescent X-rays generated from the first layer; detecting transmitting X-rays that have transmitted through the sample; identifying the density of the first layer and the absorption coefficient of X-rays at the first layer through elementary analysis based on the fluorescent X-rays; and calculating the thickness of the first layer on the basis of the absorption coefficient and the density, and the intensities of the transmitting X-rays at two different energies.

JPS5779404	DETECTING METHOD FOR LOCAL FAULTY THICKNESS OF PLATE OF METALLIC BELT TYPE MATERIAL
JPS5660332	METHOD OF MONITORING INTERNAL COMBUSTION ENGINE
JPS60133308	METHOD FOR MEASURING ATTACHED AMOUNT OF PLATED FILM

OHASHI SATOSHI (JP)
MIYAMOTO SHOHEI (JP)
AOYAMA TOMOKI (JP)
MIYASAKA SHINTARO (JP)
NAGURA MAKOTO (JP)
HIROSE JUN (JP)
MATSUNAGA DAISUKE (JP)

PCT/JP2023/023738

January 04, 2024

June 27, 2023

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HORIBA LTD (JP)

G01B15/02; G01N23/087; G01N23/223

JPS6138509U	1986-03-11
JPS6391506A	1988-04-22
JPH0394444A	1991-04-19

KOHNO, Hideto et al. (JP)

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