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Title:
THIN FILM CAPACITOR AND ELECTRONIC CIRCUIT BOARD EQUIPPED WITH SAME
Document Type and Number:
WIPO Patent Application WO/2022/004021
Kind Code:
A1
Abstract:
[Problem] To provide a highly flexible thin film capacitor. [Solution] A thin film capacitor 1 comprises: a metal foil 10 that has a roughened top surface 11; a dielectric film D that covers the top surface 11 of the metal foil 10 and has an opening for partially exposing the metal foil 10; a first electrode layer that is in contact with the metal foil 10 via the opening; and a second electrode layer that is in contact with the dielectric film D without being in contact with the metal foil 10. The particle sizes of the crystals in the center portion, which has not been roughened, of the metal foil 10 are less than 15 μm in the planar direction and less than 5 μm in the thickness direction. As a result, the flexibility of the metal foil is enhanced, which not only reduces short circuit faults after embedding the foil in a multilayer substrate but also increases positioning precision.

Inventors:
ISHII DAIKI (JP)
YANO YOSHIHIKO (JP)
YAMASHITA YUKI (JP)
YOSHIDA KENICHI (JP)
TAKAHASHI TETSUHIRO (JP)
Application Number:
PCT/JP2020/048397
Publication Date:
January 06, 2022
Filing Date:
December 24, 2020
Export Citation:
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Assignee:
TDK CORP (JP)
International Classes:
H01G4/33; H01G9/048; H01G9/052
Domestic Patent References:
WO2017026233A12017-02-16
WO2006118236A12006-11-09
WO2007010768A12007-01-25
Foreign References:
JP2000091164A2000-03-31
JP2007149730A2007-06-14
JP2001203455A2001-07-27
JP2008078299A2008-04-03
JP2020072192A2020-05-07
JP2006186093A2006-07-13
Attorney, Agent or Firm:
WASHIZU Mitsuhiro et al. (JP)
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