Title:
THIN FILM CAPACITOR AND ELECTRONIC CIRCUIT BOARD COMPRISING SAID THIN FILM CAPACITOR
Document Type and Number:
WIPO Patent Application WO/2022/004020
Kind Code:
A1
Abstract:
[Problem] Provide a thin film capacitor with high adhesion to a circuit board. [Solution] This thin film capacitor 1 comprises: a metal foil 10 in which a top surface 11 is roughened; a dielectric film D that covers the top surface 11 of the metal foil 10, and has an opening that partially exposes the metal foil 10; a first electrode layer that is in contact with the metal foil 10 via the opening; and a second electrode layer that is in contact with the dielectric film D without being in contact with the metal foil 10. An angle θa formed by the other main surface 12 and a side surface 13 of the metal foil 10 is greater than 20° and less than 80°. In this way, since this is a tapered shape in which the angle of the side surface 13 is greater than 20° and less than 80°, warping is suppressed, and when embedded in a multilayer board, there is improved adhesion with the multilayer board.
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Inventors:
ISHII DAIKI (JP)
YANO YOSHIHIKO (JP)
YAMASHITA YUKI (JP)
YOSHIDA KENICHI (JP)
TAKAHASHI TETSUHIRO (JP)
YANO YOSHIHIKO (JP)
YAMASHITA YUKI (JP)
YOSHIDA KENICHI (JP)
TAKAHASHI TETSUHIRO (JP)
Application Number:
PCT/JP2020/048396
Publication Date:
January 06, 2022
Filing Date:
December 24, 2020
Export Citation:
Assignee:
TDK CORP (JP)
International Classes:
H01G4/33; H01G9/048; H01G9/052
Domestic Patent References:
| WO2017026233A1 | 2017-02-16 | |||
| WO2018008625A1 | 2018-01-11 | |||
| WO2007010768A1 | 2007-01-25 |
Foreign References:
| JP2009246110A | 2009-10-22 | |||
| JP2001203455A | 2001-07-27 | |||
| JP2008078299A | 2008-04-03 | |||
| JP2007149730A | 2007-06-14 | |||
| JP2018137311A | 2018-08-30 | |||
| JP2020072192A | 2020-05-07 |
Attorney, Agent or Firm:
WASHIZU Mitsuhiro et al. (JP)
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