Title:
THIN FILM CAPACITOR, PRODUCTION METHOD THEREFOR, AND ELECTRONIC CIRCUIT BOARD COMPRISING THIN FILM CAPACITOR
Document Type and Number:
WIPO Patent Application WO/2022/004013
Kind Code:
A1
Abstract:
[Problem] To provide a thin film capacitor in which a pair of terminal electrodes can be disposed on the same surface. [Solution] A thin film capacitor 1 comprises: a metal foil 10, the upper surface 11 of which has been roughened; a dielectric film D which covers the upper surface 11 of the metal foil 10 and which has an opening that partially exposes the metal foil 10; a first electrode layer which makes contact with the metal foil 10 via the opening; and a second electrode layer which makes contact with the dielectric film D without making contact with the metal foil 10. Thus, it is possible to dispose both the first and second electrode layers on the upper surface 11 of the metal foil 10. Furthermore, because the metal foil 10 has been roughened, it is possible to obtain a large capacitance.
Inventors:
YAMASHITA YUKI (JP)
YOSHIDA KENICHI (JP)
YANO YOSHIHIKO (JP)
ISHII DAIKI (JP)
YOSHIDA KENICHI (JP)
YANO YOSHIHIKO (JP)
ISHII DAIKI (JP)
Application Number:
PCT/JP2020/048389
Publication Date:
January 06, 2022
Filing Date:
December 24, 2020
Export Citation:
Assignee:
TDK CORP (JP)
International Classes:
H01G4/33; H01G9/048; H01G9/052
Domestic Patent References:
| WO2017026233A1 | 2017-02-16 | |||
| WO2007010768A1 | 2007-01-25 | |||
| WO2006118236A1 | 2006-11-09 |
Foreign References:
| JP2009246110A | 2009-10-22 | |||
| JP2001203455A | 2001-07-27 | |||
| JP2008078299A | 2008-04-03 | |||
| JP2007149730A | 2007-06-14 | |||
| JP2006186093A | 2006-07-13 | |||
| JP2003197463A | 2003-07-11 | |||
| JP2018082013A | 2018-05-24 |
Attorney, Agent or Firm:
WASHIZU Mitsuhiro et al. (JP)
Download PDF:
Previous Patent: REFRIGERATOR
Next Patent: THIN FILM CAPACITOR AND ELECTRONIC CIRCUIT SUBSTRATE PROVIDED THEREWITH
Next Patent: THIN FILM CAPACITOR AND ELECTRONIC CIRCUIT SUBSTRATE PROVIDED THEREWITH