Title:
THIN FILM CAPACITOR AND ELECTRONIC CIRCUIT SUBSTRATE PROVIDED THEREWITH
Document Type and Number:
WIPO Patent Application WO/2022/004014
Kind Code:
A1
Abstract:
[Problem] To provide a thin film capacitor in which the peeling of an electrode layer does not readily occur. [Solution] A thin film capacitor 1 comprises: a metal foil 10 which has a roughened upper surface 11; a dielectric film D which covers the upper surface 11 of the metal foil 10 and has an opening for partially exposing the metal foil 10; a first electrode layer which is in contact with the metal foil 10 via the opening, and which is in contact with the dielectric film D; and a second electrode layer which is in contact with the dielectric film D without being in contact with the metal foil 10. It is thereby possible to dispose both the first and second electrode layers on the upper surface 11 of the metal foil 10. Furthermore, the first electrode layer is in contact with not only the metal foil 10 but also the dielectric film D, and thus peeling of the first electrode layer does not readily occur.
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Inventors:
ISHII DAIKI (JP)
YANO YOSHIHIKO (JP)
YOSHIDA KENICHI (JP)
TAKAHASHI TETSUHIRO (JP)
YAMASHITA YUKI (JP)
YANO YOSHIHIKO (JP)
YOSHIDA KENICHI (JP)
TAKAHASHI TETSUHIRO (JP)
YAMASHITA YUKI (JP)
Application Number:
PCT/JP2020/048390
Publication Date:
January 06, 2022
Filing Date:
December 24, 2020
Export Citation:
Assignee:
TDK CORP (JP)
International Classes:
H01G4/33; H01G9/048; H01G9/052
Domestic Patent References:
| WO2017026233A1 | 2017-02-16 | |||
| WO2007010768A1 | 2007-01-25 |
Foreign References:
| JP2009246110A | 2009-10-22 | |||
| JP2001203455A | 2001-07-27 | |||
| JP2008078299A | 2008-04-03 | |||
| JP2007149730A | 2007-06-14 |
Attorney, Agent or Firm:
WASHIZU Mitsuhiro et al. (JP)
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