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Title:
THIN-FILM COMPOSITE MATERIAL, AND USING THE SAME, WIRING BOARD MATERIAL, WIRING BOARD, ELECTRONIC PART MATERIAL AND ELECTRONIC PART, AND PROCESS FOR PRODUCTION THEREOF
Document Type and Number:
WIPO Patent Application WO/2005/080073
Kind Code:
A1
Abstract:
A thin-film composite material with which a capacitor can be formed without need to conduct processing at high temperature; and using the same, a wiring board material, wiring board, electronic part material and electronic part; and a process for producing them. There is provided a process for producing a thin-film composite material, comprising the step of forming a metallic thin film layer of at least one metal selected from the group consisting of Cr, Ni, Au, Ag and alloys of these on one major surface of a copper foil; the step of forming a first composite metal oxide thin-film layer consisting of an amorphous composite metal oxide containing Ti and further Ba and/or Sr as constituent elements on the surface of the metallic thin-film layer; and the step of forming a second composite metal oxide thin-film layer comprising at least a crystalline composite metal oxide containing Ti and further Ba and/or Sr as constituent elements on the surface of the first composite metal oxide thin-film layer, characterized in that in the step of forming the first composite metal oxide thin-film layer, heat treatment is carried out at 400°C or below.

Inventors:
HIRATA YOSHITAKA (JP)
KUMASHIRO YASUSHI (JP)
TAKANEZAWA SHIN (JP)
SHIMADA YASUSHI (JP)
KONDOU YUUSUKE (JP)
YAMAGUCHI MASANORI (JP)
SHIMAYAMA YUICHI (JP)
YAMAMOTO KAZUNORI (JP)
Application Number:
PCT/JP2004/013521
Publication Date:
September 01, 2005
Filing Date:
September 16, 2004
Export Citation:
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Assignee:
HITACHI CHEMICAL CO LTD (JP)
HIRATA YOSHITAKA (JP)
KUMASHIRO YASUSHI (JP)
TAKANEZAWA SHIN (JP)
SHIMADA YASUSHI (JP)
KONDOU YUUSUKE (JP)
YAMAGUCHI MASANORI (JP)
SHIMAYAMA YUICHI (JP)
YAMAMOTO KAZUNORI (JP)
International Classes:
H01G4/20; H05K1/16; (IPC1-7): B32B9/00; H01B3/12; H05K1/16
Domestic Patent References:
WO2003002782A12003-01-09
Foreign References:
JPH08245263A1996-09-24
JPH0831951A1996-02-02
JPH08161933A1996-06-21
JPH0897532A1996-04-12
Attorney, Agent or Firm:
Miyoshi, Hidekazu (Toranomon 1-chome Minato-ku, Tokyo, JP)
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