Title:
THIN-FILM PLANARIZATION METHOD, PLANARIZED THIN-FILM FORMATION METHOD, AND THIN-FILM FORMATION VARNISH
Document Type and Number:
WIPO Patent Application WO/2015/182667
Kind Code:
A1
Abstract:
Provided are a thin-film planarization method, a planarized thin-film formation method, and a thin-film formation varnish to be used in these methods, in which when forming a thin film using a thin-film formation varnish which includes an organic compound and an organic solvent, the varnish flow activation energy is set to no more than 28kJ/mol.
Inventors:
OTANI NAOKI (JP)
Application Number:
PCT/JP2015/065278
Publication Date:
December 03, 2015
Filing Date:
May 27, 2015
Export Citation:
Assignee:
NISSAN CHEMICAL IND LTD (JP)
International Classes:
H01L51/50; C09D201/00; H05B33/10
Foreign References:
| JPH1053737A | 1998-02-24 | |||
| JP2002338861A | 2002-11-27 | |||
| JPH0525419A | 1993-02-02 | |||
| JP2008507598A | 2008-03-13 |
Other References:
See also references of EP 3151298A4
Attorney, Agent or Firm:
KOJIMA Takashi et al. (JP)
Takashi Kojima (JP)
Takashi Kojima (JP)
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