Title:
THREE-DIMENSIONAL LED PACKAGE MODULE WITH ANNULAR FILAMENTS
Document Type and Number:
WIPO Patent Application WO/2018/058924
Kind Code:
A1
Abstract:
A three-dimensional LED package module with annular filaments. A metal strip is die-cut into a rudiment of an annular filament holder (1) comprising multiple interconnected units for two or more LEDs; metal connectors (1.6a, 1.6b) are provided between rings (1.1, 1.2, 1.3) of each unit for supporting or/and electrical connection; after electroplating and injection molding, each ring is reinforced using plastic, and loop circuits are connected by means of a plastic insulator (2) at the disconnected position; an LED chip (3) is packaged on each ring and is connected to the metal loop circuit by means of a solder wire (4); in each unit, the rings are connected in series, or in parallel, or in a combined mode of series and parallel connections; the LED filament package module with the multiple interconnected units is divided into multiple single units, and the multiple annular rings in the unit are drawn apart along an axial direction, so as to form a three-dimensional LED package module with an annular filament. The filament package module has good heat conduction and dissipation performance, emits uniform light on multiple surfaces, and has an aesthetic appearance.
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Inventors:
WANG DINGFENG (CN)
XU WENHONG (CN)
XU WENHONG (CN)
Application Number:
PCT/CN2017/078716
Publication Date:
April 05, 2018
Filing Date:
March 30, 2017
Export Citation:
Assignee:
WANG DINGFENG (CN)
International Classes:
H01L25/13; H01L33/48; H01L33/62
Domestic Patent References:
| WO2016058539A1 | 2016-04-21 |
Foreign References:
| CN205065341U | 2016-03-02 | |||
| CN203810155U | 2014-09-03 | |||
| CN204348760U | 2015-05-20 | |||
| CN104465638A | 2015-03-25 | |||
| CN203932051U | 2014-11-05 | |||
| US6659632B2 | 2003-12-09 |
Attorney, Agent or Firm:
SHENZHEN ARK INTELLECTUAL PROPERTY AGENT LLP (CN)
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