Title:
THREE-DIMENSIONAL ON-LINE MONITORING METHOD AND APPARATUS FOR WARPAGE DEFORMATION AND DEFECTS OF PACKAGING MODULE
Document Type and Number:
WIPO Patent Application WO/2021/073309
Kind Code:
A1
Abstract:
A three-dimensional on-line monitoring method and apparatus for warpage deformation and defects of a packaging module; first warpage information of a packaging module sample (5) to be tested is obtained by means of a projection moiré module; second warpage information of the packaging module sample (5) to be tested is obtained by means of an ultrasonic module; and monitoring result information is obtained according to the first warpage information and the second warpage information. Thus, the problem in the existing technology in which warpage deformation and defects of a packaging module cannot be monitored on-line is solved, and the failure of packaging modules of electronic devices can be monitored on-line.
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Inventors:
CHEN ZHIWEN (CN)
LIU SHENG (CN)
LIU LI (CN)
WANG LICHENG (CN)
LIU SHENG (CN)
LIU LI (CN)
WANG LICHENG (CN)
Application Number:
PCT/CN2020/113767
Publication Date:
April 22, 2021
Filing Date:
September 07, 2020
Export Citation:
Assignee:
UNIV WUHAN (CN)
International Classes:
G01B11/16; G01B17/04; G01N21/88
Foreign References:
| CN110645903A | 2020-01-03 | |||
| CN210833445U | 2020-06-23 | |||
| CN105716546A | 2016-06-29 | |||
| CN107093566A | 2017-08-25 | |||
| CN102854196A | 2013-01-02 | |||
| CN104964656A | 2015-10-07 | |||
| JPS6265433A | 1987-03-24 | |||
| JP2016006382A | 2016-01-14 |
Attorney, Agent or Firm:
WUHAN KEHAO INTELLECTUAL PROPERTY ATTORNEYS(SPECIAL GENERAL PARTNERSHIP) (CN)
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