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Patent Searching and Data


Title:
TIME-DOMAIN HEAT CONDUCTION SIMULATION METHOD AND STORAGE MEDIUM
Document Type and Number:
WIPO Patent Application WO/2024/041642
Kind Code:
A1
Abstract:
Disclosed in the present invention is a time-domain heat conduction simulation method. The method comprises: performing geometric modeling and mesh generation by using a finite-element mesh generation tool, and reading geometric information; setting parameters related to each region material during solid heat transfer analysis; constructing a basic equation for a thermal time-domain finite element to calculate the value of each element in an element matrix, wherein a linear nodal-based scalar basis function based on a tetrahedral element is used for a thermal finite element, and obtaining an element matrix of each element; by means of the numbers of each element, each node and each side, making elements in element matrices correspond to elements in a global matrix, wherein the global matrix is obtained by means of traversing, superposing and utilizing the element matrices; and performing iterative operation on each time step by means of the basic equation for a thermal time-domain finite element. By means of the present invention, an accurate time-domain heat conduction simulation result can be obtained.

Inventors:
PU BO (CN)
HE QIUSEN (CN)
FAN JUN (CN)
Application Number:
PCT/CN2023/114983
Publication Date:
February 29, 2024
Filing Date:
August 25, 2023
Export Citation:
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Assignee:
NINGBO DETOOLIC TECH CO LTD (CN)
International Classes:
G06F30/23
Foreign References:
CN115374673A2022-11-22
CN114117864A2022-03-01
CN102033985A2011-04-27
CN109190169A2019-01-11
CN109492341A2019-03-19
US20090228246A12009-09-10
Attorney, Agent or Firm:
BEIJING GAOWO LAW FIRM (CN)
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