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Title:
TIN OR TIN ALLOY ELECTROPLATING SOLUTION, METHOD FOR FORMING BUMPS, AND METHOD FOR PRODUCING CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2021/153160
Kind Code:
A1
Abstract:
One mode of this tin or tin alloy electroplating solution contains: a soluble salt (A) including at least a first tin salt; one or more compounds (B) selected from the group consisting of organic acids, inorganic acids, and salts thereof; a surfactant (C) which is a polyoxyethylene polycyclic phenyl ether sulfuric acid ester salt represented by general formula (1); and a leveling agent (D). Note that in general formula (1), m represents an integer of 1-3, n represents an integer of 10-30, and X represents a cation.

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Inventors:
SUSUKI KYOKA (JP)
WATANABE MAMI (JP)
NAKAYA KIYOTAKA (JP)
TATSUMI KOJI (JP)
INOUE JYUNTA (JP)
Application Number:
PCT/JP2021/000008
Publication Date:
August 05, 2021
Filing Date:
January 04, 2021
Export Citation:
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Assignee:
MITSUBISHI MATERIALS CORP (JP)
International Classes:
C25D3/32; C25D3/60; C25D5/50; C25D7/00
Domestic Patent References:
WO2010055917A12010-05-20
Foreign References:
JP2015193916A2015-11-05
JPH05311483A1993-11-22
JP2000026991A2000-01-25
JP2002530528A2002-09-17
JP2005308858A2005-11-04
US20030101910A12003-06-05
US20180118671A12018-05-03
JP2020011013A2020-01-23
JP2020212144A2020-12-22
JP6133056B22017-05-24
JP6006683B22016-10-12
JP2016074963A2016-05-12
JP2015193916A2015-11-05
Attorney, Agent or Firm:
MATSUNUMA Yasushi et al. (JP)
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