TIN PLATING SOLUTION, PLATING METHOD USING THE TIN PLATING SOLUTION, METHOD FOR PREPARING TIN PLATING SOLUTION AND CHIP PARTS HAVING TIN PLATING LAYER FORMED BY USING THE TIN PLATING SOLUTION

WIPO Patent Application WO/2006/117920

A1

Provided is a tin plating solution which is less susceptible to forming a sludge even after the storage for a long time and has a markedly long life as a plating solution. A tin plating solution for carrying out an electrolytic tin plating, characterized in that it contains a tin salt as a supply source of a tin ion in an amount of 5 to 30 g/L in terms of tin, a chelating agent for chelating and stabilizing the tin ion and a pH adjusting agent; and a method for preparing the tin plating solution, characterized in that it comprises adding tin methanesulfonate into a solution being neutral to alkaline, to thereby form a tin chelate complex.

JP2001234386	NEUTRAL TINNING BATH COMPOSITION AND SOLDERING BATH COMPOSITION
WO/1996/020296	USE OF CHROMIUM DERIVATIVES AS BRIGHTENERS
JP3902829	NEUTRAL TINNING BATH

KAWASHIMA SATOSHI (JP)
TASHIRO HIROYUKI (JP)
EMURA SHIGENORI (JP)
NASHIYAMA TAKAMITSU (JP)
SAMPEI HIDEYUKI (JP)

PCT/JP2006/303124

November 09, 2006

February 22, 2006

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MELTEX INC (JP)
KAWASHIMA SATOSHI (JP)
TASHIRO HIROYUKI (JP)
EMURA SHIGENORI (JP)
NASHIYAMA TAKAMITSU (JP)
SAMPEI HIDEYUKI (JP)

C25D3/32; C25D7/00

JP2003293186A	2003-10-15
JP2005126773A	2005-05-19

Yoshimura, Katsuhiro c/o Yoshimura International Patent Office Omiya F Bldg. 5-4 (Sakuragicho 2-chome Omiya-k, Saitama-shi Saitama 54, JP)

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