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Patent Searching and Data


Title:
TOFU DOUGH CUTTING DEVICE AND METHOD FOR PRODUCING DEEP-FRIED TOFU USING SAME
Document Type and Number:
WIPO Patent Application WO/2022/034908
Kind Code:
A1
Abstract:
Provided is a tofu dough cutting device by which corner parts can be hygienically and accurately cut while suppressing costs. Also provided is a method for producing deep-fried tofu using the cutting device. This tofu dough cutting device comprises cutting sections including a first cutting section, said first cutting section being provided with a horizontal cutting blade for cutting a sheet-type tofu dough in the direction perpendicular to the conveying direction of the tofu dough, and a second cutting section, said second cutting section being provided with a composite cutting blade in which a longitudinal cutting blade, which is for cutting the tofu dough in the same direction as the conveying direction, is integrated with a corner part-cutting blade which is formed at least at one end of the longitudinal cutting blade for bevelling a corner part.

Inventors:
TAKAI TOICHIRO (JP)
Application Number:
PCT/JP2021/029690
Publication Date:
February 17, 2022
Filing Date:
August 11, 2021
Export Citation:
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Assignee:
TAKAI TOFU & SOYMILK EQUIPMENT CO (JP)
International Classes:
A23L11/45
Foreign References:
JP2015180195A2015-10-15
JP2000300201A2000-10-31
JPH11169302A1999-06-29
JP3017507U1995-10-31
JP2008029246A2008-02-14
JP2017099349A2017-06-08
Attorney, Agent or Firm:
EIKOH PATENT FIRM, P.C. (JP)
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