TOP SLITTER CUTTING DEPTH ADJUSTING STRUCTURE

WIPO Patent Application WO/2023/087208

A1

A top slitter cutting depth adjusting structure, comprising an upper template (1). An upper cutter seat (2) is provided on the upper template; upper cutters (3) are provided on the upper cutter seat; a plurality of stepped holes (4) are formed on the upper cutter seat; a hook nail (5) is provided in and passes through each stepped hole, and the hook nails are enabled by first springs to float; the upper cutters are fixed to the lower ends of the hook nails; a plurality of ejector rods (8) capable of vertically moving are provided in and pass through the upper template; the ejector rods are configured to act on the upper ends of the hook nails; a pressing plate (9) is provided above the upper template; adjusting assemblies are provided on the pressing plate and correspond to the ejector rods; each adjusting assembly comprises a pressing screw (10); nuts (11) are provided on the pressing plate; the pressing screws are in threaded fit with the nuts, and the pressing screws pass through the pressing plate and abut against the ejector rods; the pressing screws are configured to adjust, by means of rotation of the pressing screws, the cutting depths of the upper cutters.

CAI LEIMING (CN)
CHEN ZHAOMAO (CN)
XU QINGSONG (CN)
YE MINSHENG (CN)

PCT/CN2021/131467

May 25, 2023

November 18, 2021

Click for automatic bibliography generation  

WUXI MICRO RES CO LTD (CN)

B23D35/00; B23B29/00

CN208840312U	2019-05-10
CN2865959Y	2007-02-07
CN210847876U	2020-06-26
JP2020104225A	2020-07-09
CN211515742U	2020-09-18
CN109013833A	2018-12-18
CN209393800U	2019-09-17

BEYOND ATTORNEYS AT LAW (CN)

View/Download PDF      PDF Help

Previous Patent: DISPLAY MODULE AND DISPLAY APPARATUS

Next Patent: ELECTROCHEMICAL DEVICE AND ELECTRONIC DEVICE