Title:
TRANSFER DEVICE AND TRANSFER METHOD OF MICRO LIGHT EMITTING DIODE
Document Type and Number:
WIPO Patent Application WO/2018/214201
Kind Code:
A1
Abstract:
Provided is a transfer device and transfer method of a micro light emitting diode. The transfer device of a micro light emitting diode comprises: a main body, as well as a liquid discharging module, a cooling module, and a heating module disposed on the main body. A metal adhesive liquid is discharged to a micro light emitting diode to be transferred by means of the liquid discharging module; the metal adhesive liquid on the micro light emitting diode to be transferred is cooled by means of the cooling module so that the metal adhesive liquid is cured; the main body and the micro light emitting diode to be transferred are adhered together for micro light emitting diode transfer; the cured metal adhesive liquid is heated by means of the heating module after transfer is performed in place so that the metal adhesive liquid is melted; the main body and the micro light emitting diode to be transferred are separated. For a micro light emitting diode, the transfer difficulty can be reduced and the transfer efficiency can be improved.
Inventors:
LU MACAI (CN)
YAO JIANGBO (CN)
YAO JIANGBO (CN)
Application Number:
PCT/CN2017/089260
Publication Date:
November 29, 2018
Filing Date:
June 20, 2017
Export Citation:
Assignee:
SHENZHEN CHINA STAR OPTOELECT (CN)
International Classes:
H01L21/683; H01L33/00
Domestic Patent References:
| WO2016207640A1 | 2016-12-29 |
Foreign References:
| CN106299079A | 2017-01-04 | |||
| US20140033528A1 | 2014-02-06 | |||
| JP2001318604A | 2001-11-16 |
Attorney, Agent or Firm:
COMIPS INTELLECTUAL PROPERTY OFFICE (CN)
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