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Title:
TRANSFER STATE INSPECTION SYSTEM AND COMPONENT MOUNTER
Document Type and Number:
WIPO Patent Application WO/2018/207339
Kind Code:
A1
Abstract:
A transfer state inspection system that is provided with a camera (21) for imaging the transfer state of a transfer material that consists of either solder, flux, conductor paste, or an adhesive and has been transferred to a plurality of terminals (41, 42) on the bottom side of an electronic component (18) and an image processing unit (35) for recognizing the transfer state of the transfer material by processing the image imaged by the camera, the transfer state inspection system serving to inspect the transfer state of the transfer material on the basis of the recognition results of the image processing unit, wherein provided are an inspection object designation unit (36) for designating, through an operator operation or a manufacturing program, whether inspection is necessary for at least some of the terminals from among the plurality of terminals on the bottom side of the electronic component and an inspection execution unit (37) for inspecting the transfer state of the transfer material for only the terminals from among the plurality of terminals on the bottom side of the electronic component other than the terminals that have been designated as not requiring inspection by the inspection object designation unit.

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Inventors:
KOBAYASHI TAKAHIRO (JP)
OIKE HIROSHI (JP)
KOTANI KAZUYA (JP)
Application Number:
PCT/JP2017/017999
Publication Date:
November 15, 2018
Filing Date:
May 12, 2017
Export Citation:
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Assignee:
FUJI CORP (JP)
International Classes:
G01B11/24; G01N21/956; H05K3/34; H05K13/08
Domestic Patent References:
WO2014184855A12014-11-20
WO2001020255A12001-03-22
Foreign References:
JP2008298436A2008-12-11
JP2014215153A2014-11-17
JP2008216140A2008-09-18
JP2008216140A2008-09-18
Other References:
See also references of EP 3623750A4
Attorney, Agent or Firm:
KAKO, Muneo (JP)
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