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Patent Searching and Data


Title:
TRANSMISSION LINE, TRANSMISSION LINE MANUFACTURING METHOD, AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2021/095642
Kind Code:
A1
Abstract:
A transmission line according to the present invention comprises: a first structure having a flexible first resin base material and a first ground conductor that is formed in the first resin base material; a second structure having a flexible second resin base material, and a first signal line and an interlayer connection conductor that are formed in the second resin base material; a first spacer that is disposed between the first structure and the second structure; and a first metal joining material that joins the first structure and the second structure with the first spacer therebetween. The first structure and the second structure are joined with the first spacer therebetween, whereby a first hollow part is formed between the first structure and the second structure. The first signal line and the first ground conductor oppose each other with the first hollow part therebetween in a joining direction. The first resin base material and the second resin base material are not in contact with each other. The first metal joining material is formed from a material having a lower melting point than the interlayer connection conductor.

Inventors:
IKEMOTO NOBUO (JP)
Application Number:
PCT/JP2020/041422
Publication Date:
May 20, 2021
Filing Date:
November 05, 2020
Export Citation:
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Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01P3/08; H01P11/00; H05K1/02; H05K1/11; H05K3/36; H05K3/40; H05K3/46
Domestic Patent References:
WO2017130731A12017-08-03
Foreign References:
JP2009094752A2009-04-30
US20060288570A12006-12-28
JP2007150526A2007-06-14
JP2013126029A2013-06-24
JPH06152208A1994-05-31
US20140159836A12014-06-12
US20080315977A12008-12-25
JP2011182311A2011-09-15
Attorney, Agent or Firm:
KAEDE PATENT ATTORNEYS' OFFICE (JP)
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