Title:
TYING DEVICE
Document Type and Number:
WIPO Patent Application WO/2000/030936
Kind Code:
A1
Abstract:
A tying device that utilizes adhesive tapes, comprising a casing formed with a guide groove through which an object to be tied is passed, a cutting mechanism for cutting the adhesive tape tied around the object, and a bonding mechanism for folding and bonding the cut ends of the adhesive tape tied around the object, the cutting mechanism and bonding mechanism being supported by the casing such that they are driven as the object is moved, wherein the casing supports a rotor adapted to be rotated on contact with the object during movement of the object, the rotor supporting at least either the cutting mechanism or the bonding mechanism, with the result that irrespective of the moving speed of the object or the driving force applied from the object side of the material to the cutting mechanism and bonding mechanism, the cutting mechanism and bonding mechanism can be reliably driven whoever uses the tying device.
Inventors:
OTSUKA YOSHIHIRO (JP)
Application Number:
PCT/JP1999/006446
Publication Date:
June 02, 2000
Filing Date:
November 18, 1999
Export Citation:
Assignee:
MG CORP (JP)
OTSUKA YOSHIHIRO (JP)
OTSUKA YOSHIHIRO (JP)
International Classes:
B65B67/06; (IPC1-7): B65B27/00; B65B67/06
Foreign References:
| US2841935A | 1958-07-08 | |||
| JPS63138917A | 1988-06-10 | |||
| JPS5498897A | 1979-08-04 | |||
| JPH046018A | 1992-01-10 | |||
| JPS5867714U | 1983-05-09 | |||
| JPS55170202U | 1980-12-06 |
Attorney, Agent or Firm:
Yoshida, Yoshiharu (Toranomon 1-chome Minato-ku Tokyo, JP)
Download PDF: