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Patent Searching and Data


Title:
ULTRASOUND ENDOSCOPE SYSTEM AND ULTRASONIC TRANSDUCER
Document Type and Number:
WIPO Patent Application WO/2021/114097
Kind Code:
A1
Abstract:
Provided are an ultrasonic transducer and an ultrasound endoscope system; an ultrasonic wafer (2) of the ultrasonic transducer surrounds the outer peripheral surface of an annularly arranged backing ring (1); an inner electrode layer (3) is located on the inner ring of the ultrasonic wafer (2); an electric pulse is applied to excite the inner surface of the ultrasonic wafer (2); an outer electrode layer (4) is located on the outer peripheral surface of the ultrasonic wafer (2); the outer surface of the ultrasonic wafer (2) is excited by applying an electric pulse; the electrode direction of the inner electrode layer (3) is arranged perpendicular to the electrode direction of the outer electrode layer (4); by means of changing the excitation position of the inner electrode layer (3) and the outer electrode layer (4) on the ultrasonic wafer (2), the ultrasonic transducer can be adjusted in the circumferential direction and the focus position, thus the imaging of the ultrasonic transducer in the sound field area is uniform and consistent.

Inventors:
MA TENG (CN)
HUANG JIQING (CN)
LI YONGCHUAN (CN)
WANG CONGZHI (CN)
LIU JIAMEI (CN)
LIU XIANGLI (CN)
YANG YE (CN)
Application Number:
PCT/CN2019/124336
Publication Date:
June 17, 2021
Filing Date:
December 10, 2019
Export Citation:
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Assignee:
SHENZHEN INST ADV TECH (CN)
International Classes:
A61B8/12
Foreign References:
CN110368032A2019-10-25
CN110235022A2019-09-13
CN109431548A2019-03-08
CN108027436A2018-05-11
CN106859700A2017-06-20
CN104582586A2015-04-29
US20060103265A12006-05-18
Attorney, Agent or Firm:
SHENZHEN IPLUS INTELLECTUAL PROPERTY AGENCY (GENERAL PARTNERSHIP) (CN)
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