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Title:
ULTRASOUND PROBE, PRODUCTION METHOD THEREFOR, AND ULTRASOUND DIAGNOSTIC EQUIPMENT
Document Type and Number:
WIPO Patent Application WO/2011/132531
Kind Code:
A1
Abstract:
Disclosed is an ultrasound probe wherein the bending of a CMUT due to thermal stress produced at the joint between a backing layer and the CMUT is minimized, thereby improving the durability of the bond between the CMUT and the backing layer. To accomplish this, the ultrasound probe is provided with: a CMUT having a vibrating element that changes the electromechanical coupling coefficient or sensitivity according to the bias voltage to be applied; a backing layer (22) bonded to the rear side of the ultrasound transmission surface of the CMUT (20); and a thermal stress balance material (24) that minimizes the bending of the CMUT (20) due to thermal stress produced between the CMUT (20), which is bonded to the backing layer, and the backing layer (22), said thermal stress balance material (24) positioned facing the CMUT (20) in such a manner that the backing layer (22) is sandwiched therebetween.

Inventors:
SAKO AKIFUMI (JP)
FUKADA MAKOTO (JP)
ISHIDA KAZUNARI (JP)
Application Number:
PCT/JP2011/058687
Publication Date:
October 27, 2011
Filing Date:
April 06, 2011
Export Citation:
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Assignee:
HITACHI MEDICAL CORP (JP)
SAKO AKIFUMI (JP)
FUKADA MAKOTO (JP)
ISHIDA KAZUNARI (JP)
International Classes:
H04R19/00; A61B8/00; H04R31/00
Domestic Patent References:
WO2009069555A12009-06-04
Foreign References:
JP2007201753A2007-08-09
JPS60102096A1985-06-06
JPS62115197A1987-05-26
JP2002112393A2002-04-12
JP2001327494A2001-11-27
Other References:
See also references of EP 2563043A4
None
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