Title:
UNDERHAIR FORMING TOOL
Document Type and Number:
WIPO Patent Application WO/2007/129772
Kind Code:
A1
Abstract:
An underhair forming tool that enables shaving off or clipping off of only side
protrusions of underhair with given morphology easily without needing proficiency
and without paying meticulous attention. There is provided an underhair forming
tool comprising underhair pattern sheet plate (1) with given morphology and,
attached to the backside thereof, pressure sensitive adhesive layer (2). Preferably,
the pressure sensitive adhesive layer on the surface thereof is furnished with
release sheet (3) with the same shape as that of the underhair pattern sheet plate
(1), wherein inside the circumferential edge, perforations (6) are provided
at fixed intervals. At use, the release sheet (3) outside the perforations (6)
is peeled off to thereby expose the pressure sensitive adhesive layer (2) at the
portion thereunder. Then, the backside of the underhair pattern sheet plate
(1) is accurately pressed against the part of underhair region to be left intact,
thereby attaining easy, safe fixing thereof. The sheet plate may consist of
a transparent or semi-transparent plastic, cloth or paper, or a metal such as
aluminum, tin or copper.
Inventors:
SAITO MOMOKO (JP)
Application Number:
PCT/JP2007/059819
Publication Date:
November 15, 2007
Filing Date:
May 08, 2007
Export Citation:
Assignee:
MITSUE BIYO LEASE CO LTD (JP)
SAITO MOMOKO (JP)
SAITO MOMOKO (JP)
International Classes:
A45D24/36; A45D26/00; A45D44/08; A45D44/12
Foreign References:
| JP3120112U | 2006-03-23 | |||
| JP2000333730A | 2000-12-05 | |||
| JP3080835U | 2001-10-12 | |||
| JPH0425608U | 1992-02-28 | |||
| JPH06237816A | 1994-08-30 |
Attorney, Agent or Firm:
MURATA, Yukio (Kita-yaesu Building 3rd Floor2-11, Nihonbashi 3-Chom, Chuo-Ku Tokyo 27, JP)
Download PDF:
Previous Patent: OPTICAL SCANNING DEVICE
Next Patent: III NITRIDE COMPOUND SEMICONDUCTOR LAMINATED STRUCTURE
Next Patent: III NITRIDE COMPOUND SEMICONDUCTOR LAMINATED STRUCTURE